Copyright ? 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks Copyright ? 2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc.
of Cree, Inc.
1212
Cree CLN6A-WKW/MKW
SOLDERING & HANDLING
1.
Cleaning
?
Don’t use unspecifed chemical liquids to clean the SMD LED; the chemical could harm the SMD LED. When washing
is necessary, please immerse the SMD LED in alcohol at normal room temperature for less than 1 minute and dry at
normal room temperature for 15 minutes before use.
?
The infuence of ultrasonic cleaning on the SMD LED depending on factors such as ultrasonic power and the way
SMD LED are mounted. Ultrasonic cleaning shall be pre-qualifed to ensure this will not cause damage to the SMD
LED.
2. Moisture Proof Packing
?
In order to prevent moisture absorption into SMD LED during the transportation and storage, SMD LED is packed
in a moisture barrier bag. Desiccants and a humidity indicator are packed together with SMD LED as the secondary
protection. The indication of humidity indicator card provides the information of humidity within SMD packing.
3. Storage
?
Shelf life in original sealed bag at storage condition of <40oC and <90%RH is 12 months. Baking is required
whenever shelf life is expired.
?
Before openning the packaging , Please check whether bag leak air or not.
?
After bag opening, the SMD LED must be stored under the condition < 30oC and < 60%RH. Under this condition,
SMD LED must be used (subject to refow) within 168 hours after bag opening, and re-baking is required when
exceeding 168 hours.
?
For baking, place SMD LED in oven at temperature 80oC±5oC and relative humidity <=10%RH, for 24 hours.
?
Take out the material from packaging bag for re-bake. Do not open the door of oven frequently during the baking
process.
4. Soldering
?
Manual soldering by soldering iron
?
The use of a soldering iron of less than 25W is recommended and the temperature of the iron must be kept at
below 315oC, with soldering time within 2 seconds.
?
The epoxy resin of SMD LED should not be in contact with tip of soldering iron.
? No mechanical stress should be exerted on the resin portion of SMD LED during soldering.
?
Handling of SMD LED should be done when the package has been cooled down to below 40oC or less. This is to
prevent the SMD LED failures due to thermal-mechanical stress during handling.
?
Refow Soldering
?
The temperature (Top surface of SMD LED) profle is as below:
Melting-point
Pre-heat
Soak
Reflow
Cooling
Time
Temperature
Heat
Sink
Solder = Lead-free
Average ramp-up rate = 4oC/s max
Peak temperature = 250oC max.
Preheat temperature = 150oC ~200oC
Time within 5oC of actual Peak Temperature = 10s max.
Preheat time = 100s max.
Duration above 217oC is 80s max.
Ramp-down rate = 6oC/s max.
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